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This machine is available in 3 versions according to the type and power of the laser.

Suitable for structuring conductive pattern on copper plate, removing solder resist, removing additional line, cover layer(CVL) cutting; also suitable for structuring other metal such as rare metal, electroplating material, film and coating material, plastic and ceramic.

Features

• IPG Filber laser with laser housing, air cooling,
• Granite X/Y table, bridge construction,
• Data processing software: CircuitCAM 7 Laser Plus
• Visionsystem with high resolution camera and reflectance light resource
• Camera supported positioning system with fiducial recognition
• X/Y/Z axises driven by high precision Servo motor
• Class C5 ball screw for X,Y,Z axises
• Digital scanning galvanometer (made in Germany)
• Telecentric lense
• Movable stand hood
• Industrial control PC and display
• Industrial dust exaust unit
• Vacuum table for material
• Heat dissipation: inlet air from front and back, bilateral exhaust ventilation
• With lens protection
• Fully sealed optical path